General Description:
Perform mechanical / packaging engineering duties in the development of power electronics and power semiconductor modules. Duties to include: packaging design, geometric tolerancing, SolidWorks CAD models and detail drawings, thermal analysis, supplier and parts evaluation, supplier assistance, design for assembly analysis, failure modes and effects analysis, structural (vibration and shock) analysis, hands on assembly, design qualification testing/analysis, working with multi-disciplined engineering team.
Principal Responsibilities:
· Computer Aided Design (using SolidWorks)
· Confer with engineers and other personnel to determine packaging that meets electrical, thermal, structural,
and system design criteria.
· Analysis: thermal, structural, manufacturability, key product characteristics / process controls, torque, failure
modes and effects, and assembly time studies.
· Product testing: thermal, flow/pressure drop, pressure withstanding, vibration, shock, torque, Highly
Accelerated Life Testing (HALT) and Environmental Stress Screening (ESS).
· New business development: concept sketches, models.
· Investigate failures to determine root cause and develop corrective actions.